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More-than-Moore25Dand3DSiPIntegration

上传者: 2019-01-10 16:28:58上传 PDF文件 6.59MB 热度 28次
IntroductionThis book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as th
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