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官方资料philips转NXP后包装的变化

上传者: 2023-01-19 03:03:12上传 PDF文件 348.59 KB 热度 11次

官方资料-philips转NXP后包装的变化Packing and label changes related tothe new brand and trade nameNXP SemiconductorsAttachment to the Advance and FinalCPCN issued on October6th,2006IntroductionOn October1st,NXP Semiconductors has become the new brand nameand trade mark for former Philips Semiconductors.As a consequence in the near future our deliveries will changeto reflect NXP name/logo.Following aspects of our deliveries are subject to change:1.Marking of all our packaged products and backside marking ofbumped dice,that currently have Philips logo or"PH"in characters.2.PQ boxes&labels on PQ boxes.3.Tubes(where applicable).All above changes will be synchronized,so a delivery will either display"Philips"or"NXP"on all above mentioned aspects.Philips indication on naked dice,TCP&COF

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