贴片电阻手册

FEATURES

• High volume product suitable for commercial and

special applicaTIons

• Metal glaze on high quality ceramic

• ProtecTIve overglaze

• Lead (Pb)-free solder contacts on Ni barrier layer

• Pure TIn plaTIng provides compatibility with lead (Pb)-free

and lead containing soldering processes

• Compatible with “Restriction of the use of Hazardous

Substances” (RoHS) directive 2002/95/EC (issue 2004)

• Excellent stability (ΔR/R ≤ 1 % for 1000 h at 70 °C)