Accurate Formulas for the Capacitance of Tapered Through Silicon Vias in 3 D ICs

Name: Accurate Formulas for the Capacitance of Tapered Through Silicon Vias in 3 D ICs
Rating: 4.5 (28 reviews)
Author: liudi57893

上传者：liudi57893 2021-04-18 02:54:54上传 PDF文件 859.26KB 热度 28次

Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs

下载地址

用户评论

更多下载

下载地址

立即下载

用户评论

Accurate Formulas for the Capacitance of Tapered Through Silicon Vias in3D ICs

Accurate Formulas for the Capacitance of Tapered-T...

大小：859KB | 2021-04-18 02:54:54
Wideband modeling and characterization of differential through silicon vias for

Wideband modeling and characterization of differen...

大小：768KB | 2021-02-27 18:28:35
A Model of Air Gap Through Silicon Vias TSVs for Millimeter Application

A Model of Air-Gap Through- Silicon Vias (TSVs) fo...

大小：709KB | 2021-02-08 23:53:48
Homemade Silicon ICs _ Computer Chips

自制芯片Homemade Silicon ICs _ Computer Chips

大小：11.98MB | 2024-07-30 05:05:28
Detection ofλDNA through silicon nitride nanopores

氮化硅纳米孔对λ-DNA过孔信号的检测,司伟,沙菁洁,本文主要研究了λ-DNA在外加电压驱动下穿过氮...

大小：388KB | 2020-08-12 17:09:21
Accurate3d posotion in indoor enviroment

Position and orientation of indoor mobile robots m...

大小：2.74MB | 2021-04-18 02:54:50
Electrical Modeling and Characterization of Shield Differential Through Silicon

Electrical Modeling and Characterization of Shield...

大小：128KB | 2021-02-08 23:53:51
3D c through.zip

3D-c-through.zip,基于arcgis javascript api 4.3的web交互...

大小：235KB | 2020-08-15 01:08:40
HFSS differential vias

HFSSdifferentialvias

大小：0B | 2020-01-01 13:42:04
Accurate3D measurement using a structured light system

Discussesamethodforobtainingaccurate3Dmeasurements...

大小：0B | 2019-06-04 15:36:25
Metal Proportion Optimization of Annular Through Silicon Via Considering Tempera

Metal Proportion Optimization of Annular Through-S...

大小：1.84MB | 2021-02-09 12:37:20
A Compact Passive Resonator Based on Through Silicon Via Technology for Microwav

A Compact Passive Resonator Based on Through-Silic...

大小：458KB | 2021-02-08 17:02:03
An analytical model of thermal mechanical stress induced by through silicon via

An analytical model of thermal mechanical stress i...

大小：1003KB | 2021-02-17 11:29:23
Device Capacitance ECN

USB ENGINEERING CHANGE NOTICE Device Capacitance A...

大小：14KB | 2020-08-30 15:53:34
Analytical Model of Internal Heat Transfer of aPower Chip with Through Silicon V

Analytical Model of Internal Heat Transfer of aPow...

大小：201KB | 2021-02-20 00:29:45
Risk Analysis in3D Risk Management through3E

3D风险分析法及3E风险管理法,仇志成,,Risk Management in different ...

大小：510KB | 2020-09-25 04:09:54