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A Single Mode Hybrid III–V/Silicon On Chip Laser Based on Flip Chip BondingTechn

上传者: 2021-02-28 04:45:44上传 PDF文件 807.7KB 热度 22次
A Single Mode Hybrid III–V/Silicon On-Chip Laser Based on Flip-Chip BondingTechnology for Optical Interconnection
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