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Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

上传者: 2021-02-17 11:17:21上传 PDF文件 842.98KB 热度 21次
The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack
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