GD32F103xx Datasheet V2.5.pdf

GD32F103xx Datasheet V2.5GigadeviceGD32F103xX Datasheet3.15. Inter- C sound(l2S)………,,…,…,…,…,…,…,…,,…,…,…,,…,…,………513.16. Secure digital input and output card interface(sD|o)…….….….…………523.17. Universal serial bus full-speed device(USBD)■■■■■■■■■523.18. Controller area network(CAN)∴523.19. External memory controller(EXMC)52320. Debug mode…533.21. Package and operation temperature ameeeaeeee.....ann.534. Electrical characteristics.mw 544.1. Absolute maximum ratings…,…,…,…,…,…,…,…,…,…,…,………544.2 Recommended dc characteristics544.3. Power consumption554. 4. EMC characteristics604.5. Power supply supervisor characteristics…….….,…,…,…,……,…,……604.6. Electrical sensitivity……624.7 External clock characteristics.wwwwwww 634.8. nternal clock characteristics……644.9. PLL characteristicsn654.10. Memory characteristics……,…,…,,…,………65411. GPIO characteristics654.12.ADCcharacterstcs674. 13. DAC characteristics674.14.L2 C characteristics∴…674.15. SPI characteristics685. Package information6951. QFN package outline dimensions……………………………………695.2. LQFP package outline dimensions……706. Ordering Information7. Revision History.74GigadeviceGD32F103xX DatasheetList of FiguresFigure 2-1. GD32F103x4/6/8/B block diagramFigure 2-2. GD32F103xC/D/E/F/G//K block diagram10Figure 2-3. GD32F103Zx LQFP144 pinoutsaa::·.::::Figure 2-4. GD32F103Vx LQFP100 pinouts国国面B国画12Figure 2-5. GD32F103RX LQFP64 pinouts13Figure 2-6. GD32F103Cx LQFP48 pinouts13Figure 2-7. GD32F103TX QFN36 pinouts14Figure 2-8. GD32F103xx clock tree19Figure 5-1. QFN package outlineFigure 5-2. LQFP package outline70GigadeviceGD32F103xX DatasheetList of tablesTable 2-1. GD32F103xx devices features and peripheral listTable 2-2. GD32F103xx devices features and peripheral list (continued)Table 2-3. GD32F103xx devices features and peripheral list(continued)Table 2-4. GD32F103xx memory mapTable 2-5. GD32F103ZX LQFP144 pin definitionsTable 2-6. GD32F103Vx LQFP100 pin definitions28Table 2-7. GD32F103Rx LQFP64 pin definitions35Table 2-8. GD32F103Cx LQFP48 pin definitions39Table 2-9. GD32F103Tx QFN36 pin definitionsTable 4-1. Absolute maximum ratings54Table 4-2. dc operating conditionsTable 4-3. Power consumption characteristics (for GD32F103x4/6/8/B devicesTable 4-4. Power consumption characteristics (for GD32F103x C/D/E/F/G//K devicesTable 4-5. Power consumption of peripherals(for GD32F103x4/6/8/B devices)57Table 4-6. Power consumption of peripherals(for GD32F103X C/D/E/F/G//K devices)Table 4-7 EMs characteristicsTable 4-8 EMI characteristics60Table 4-9. Power supply supervisor characteristics(for GD32F103x4/6/8/B devicesTable 4-10. Power supply supervisor characteristics(for GD32F103X C/D/E/F/G//K devices60Table 4-11. ESD characteristics62Table 4-12. Static latch-up characteristics62Table 4-13. High speed external clock(HXTAL) generated from a crystal/ceramic characteristics. 63Table 4-14. Low speed external clock(LXTAL) generated from a crystal/ceramic characteristics. 63Table 4-15. High speed internal clock(IRC8M) characteristics64Table 4-16. Low speed internal clock(IRC40K) characteristics64Table 4-17 PlL characteristics65Table 4-18. Flash memory characteristics…65Table 4-19. 0 port characteristics (for GD32F103X4/6/8/B devices65Table 4-20. 0 port characteristics (for GD32F103x C/D/E/F/G//K devices).......66Table 4-21. ADc characteristics∴67Table 4-22. DAC characteristics67Table 4-23.2C characteristics67Table 4-24. Standard sPi characteristics68Table 5-1. QFN package dimensions69Table 5-2. LQFP package dimensions...4171Table 6-1. Part ordering code for gD32 F103xx devicesTable 7-1. Revision history..........74GigadeviceGD32F103xX DatasheetGeneral descriptionThe GD32F103Xx device is a 32-bit general-purpose microcontroller based on the ARMrCortexTM-M3 RISC core with best ratio in terms of processing power, reduced powerconsumption and peripheral set. The Cortex TM-M3 is a next generation processor core whichis tightly coupled with a Nested Vectored Interrupt Controller(NVIC), Sys Tick timer andadvanced debug supportThe GD32F103xx device incorporates the ARM Cortex TM-M3 32-bit processor coreoperating at 108 MHz frequency with Flash accesses zero wait states to obtain maximurefficiency. It provides up to 3 MB on-chip Flash memory and up to 96 KB sRAM memory. Anextensive range of enhanced l/Os and peripherals connected to two APB buses. The devicesoffer up to three 12-bit ADCs, up to two 12-bit DACS, up to ten general 16-bit timers, two basictimers plus two PWM advanced timer, as well as standard and advanced communicationinterfaces: up to three SPls, two 12CS, three USARTS, tWo UARTs, two 12Ss, an USBD,aCAn and a sdioThe device operates from a 2.6 to 3.6V power supply and available in -40 to +85Ctemperature range. Several power saving modes provide the flexibility for maximumoptimization between wakeup latency and power consumption, an especially importantconsideration in low power applicationsThe above features make the GD32F103xx devices suitable for a wide range of applicationsespecially in areas such as industrial control, motor drives, power monitor and alarm systemsconsumer and handheld equipment, POs, vehicle GPS, video intercom, Pc peripherals andso onARMCORTEXARM-Processor TechnologyGigadeviceGD32F103xX DatasheetDevice overview2.1Device informationTable 2-1. GD32F103xx devices features and peripheral listGD32F103XXPart NumberT4 T6 T8 TB C4 C6 C8 CB R4 R6 R8 RB V8 VBF| ash (KB)16326412816326412816326412864128SRAM(KB)6102020610202061020202020General223322332233|33timer (16(10)(…)(1-9(1-3)(1)(13)bit)Advancedtimer(16./1bitSysTick11111Watchdog2222222222222RTC11112222USART(02111221222212C2112222SPI(1CAN11111111111USBD11111111GPIO2626262637373737515151518080EXMC000000000001EXTI1616161616161616161616161616Units22222222222222Channels1010101010101010161616161616PackageQFN36LQFP48LQFP64QFP100GigadeviceGD32F103xX DatasheetTable 2-2. GD32F103xx devices features and peripheral list(continued)GD32F103XXPart NumberRC RD RE RF RG RI RK VC VD VE VF VG VI VKFash(KB)2563845127681024204830722563845127681024|20483072sRAM(KB)4864649696969648646496969696General4441010101044410101010timer (16(4)(14)(14013:1413)14913)140-13)(1+)4)(14|(4913)41401041401(14013bit)Advanced22222222222222timer(160.7,7(0.7C.7)(0.7)bit目 Sys Tick|1111111111Basic22222222222222EIner5-6)(5-6)bit)Watchdog22222222222222RTC1111111USART33333|33333333UART2222222222222212C2222222222222233333333333333SPI0-2)2)0220202)02)(0-2CAN111USBD1111222222222222222s(1-2)(121(1-2)(12)SDIO1111GPIO5151515151515180808080808080EXMC00000001EXTI1616161616161616161616161616Units3333333333Channels1616161616161616161616161616DAC22222222222222PackageLQFP64LQFP100GigadeviceGD32F103xX DatasheetTable 2-3. GD32F103xx devices features and peripheral list(continued)GD32F103xXPart numberZCZDZEZFZGZZKFlash( KB)256384512768102420483072SRAM (KB)486464General4101010timer(16-bit)(1-413114,8-13)Advanced2222timer(16-bitSys TickBasic timer(1622222bit)Watchdog2222TCUSART3333UART2222212C2223SPICAN1USBD212SSDIOGPIO112112112112112112112EXMCEXTI161616161616Units3s212121212121DAC222PackageLQFP144GigadeviceGD32F103xX Datasheet2.2.Block diagramFigure 2-1. GD32F103x4/6/8/B block diagramUSW/JTAGPOR/PDRFlashARM Cortex-M3MemoryTMemhoryFmac: 108MHFMC12VNVICAHB Pe8MHzDMAO chsSRAMControllerSRAMHXTALEXMCLN小 AHB to APB AHB to APB4-16MHzSavel Bridge 2USARTO KCANOPowered By VcDASlaveWDGTADCO KrXTIMER112-biSAR ADCADC1 KX→TMER2Powered Ey VorAGPIOAAN〉TMER3SPI1GPIOC KXUSART1PoD下小USART2GPIOE2c0「 TMERO K2C1USBDFWDGTRTC