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gensys RF board design flow

上传者: 2019-09-15 02:31:35上传 PDF文件 1.59MB 热度 27次
Trends•Morecomplexmultilayer,multifunctionalRFboards•HigherintegrationofdifferenttechnologieslikeRFandMultichipModules(MCM),die-in-board,...•3DStackingofboardlaminateswithMultichipModulesandRFwirelesstechnologies
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