镁光 DRAM HMC 规则 带宽160GB/s
HybridMemoryCube(HMC)isasinglepackagecontainingfourDRAMdieandonelogicdie,allstackedtogetherusingthrough-siliconvia(TSV)technology.Withineachcube,memoryisorganizedvertically—portionsofeachmemorydiearecombinedwiththecorrespondingportionsoftheothermemorydieinthestack.Eachgroupingofme
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