Cadence_SPB16.2中文教程.pdf

第 1 章焊盘制作 .........................................................................................................1 1.1 用Pad Designer 制作焊盘...........................................................................................1 1.2 制作圆形热风焊盘.......................................................................................... .............6 第2 章建立封装 .......................................................................................................10 2.1 新建封装文件.............................................................................................................10 2.2 设置库路径.................................................................................................................11 2.3 画元件封装.................................................................................................................12 第3 章元器件布局 ...................................................................................................23 3.1 建立电路板(PCB) ......................................................................................................23 3.2 导入网络表.................................................................................................................24 3.3 摆放元器件.................................................................................................................26 第4 章 PCB 布线.......................................................................................................31 4.1 PCB 层叠结构............................................................................................................31 4.2 布线规则设置.............................................................................................................33 4.2.1 对象(object) ....................................................................................................35 4.2.2 建立差分对.....................................................................................................36 4.2.3 差分对规则设置.............................................................................................37 4.2.4 CPU 与DDR 内存芯片走线约束规则..........................................................39 4.2.5 设置物理线宽和过孔.....................................................................................45 4.2.6 设置间距约束规则.........................................................................................52 4.2.7 设置相同网络间距规则.................................................................................55 4.3 布线.............................................................................................................................56 4.3.1 手工拉线.........................................................................................................56 4.3.2 应用区域规则.................................................................................................59 4.3.3 扇出布线.........................................................................................................60 4.3.4 差分布线.........................................................................................................62 4.3.5 等长绕线.........................................................................................................64 4.3.6 分割平面.........................................................................................................65 第5 章输出底片文件 ...............................................................................................70 5.1 Artwork 参数设置......................................................................................................70 5.2 生成钻孔文件.............................................................................................................75 5.3 输出底片文件.............................................................................................................79 .............6 第2 章建立封装 .......................................................................................................10 2.1 新建封装文件.............................................................................................................10 2.2 设置库路径.................................................................................................................11 2.3 画元件封装.................................................................................................................12 第3 章元器件布局 ...................................................................................................23 3.1 建立电路板(PCB) ......................................................................................................23 3.2 导入网络表.................................................................................................................24 3.3 摆放元器件.................................................................................................................26 第4 章 PCB 布线.......................................................................................................31 4.1 PCB 层叠结构............................................................................................................31 4.2 布线规则设置.............................................................................................................33 4.2.1 对象(object) ....................................................................................................35 4.2.2 建立差分对.....................................................................................................36 4.2.3 差分对规则设置.............................................................................................37 4.2.4 CPU 与DDR 内存芯片走线约束规则..........................................................39 4.2.5 设置物理线宽和过孔.....................................................................................45 4.2.6 设置间距约束规则.........................................................................................52 4.2.7 设置相同网络间距规则.................................................................................55 4.3 布线.............................................................................................................................56 4.3.1 手工拉线.........................................................................................................56 4.3.2 应用区域规则.................................................................................................59 4.3.3 扇出布线.........................................................................................................60 4.3.4 差分布线.........................................................................................................62 4.3.5 等长绕线.........................................................................................................64 4.3.6 分割平面.........................................................................................................65 第5 章输出底片文件 ...............................................................................................70 5.1 Artwork 参数设置......................................................................................................70 5.2 生成钻孔文件.............................................................................................................75 5.3 输出底片文件.............................................................................................................79