Cadence印刷电路板设计AllegroPCBEditor设计指南

Cadence印刷电路板设计 Allegro PCB Editor设计指南（第一版） 目 录 第1 章 PCB设计介绍................................................................................................................1 1.1 PCB 设计的发展趋势..........................................................................................................1 1.1.1 PCB 的历史...............................................................................................................1 1.1.2 PCB 设计的发展趋势............................................................................................... 1 1.2 PCB 设计流程简介..............................................................................................................4 1.3 高级PCB 设计工程师的必备知识....................................................................................5 1.4 基于Cadence 平台的PCB 设计........................................................................................5 第2 章 Allegro SPB 平台简介................................................................................................8 2.1 Cadence PCB 设计解决方案...............................................................................................8 2.1.1 PCB Editor技术........................................................................................................9 2.1.2 高速设计.................................................................................................................12 2.1.3 小型化.....................................................................................................................14 2.1.4 设计规划与布线.....................................................................................................14 2.1.5 生产制造选件.........................................................................................................15 2.1.6 模拟/射频设计........................................................................................................17 2.1.7 团队协作设计.........................................................................................................18 2.1.8 PCB Autorouter 技术..............................................................................................18 2.2 Allegro SPB 软件安装......................................................................................................18 第3 章 原理图和PCB交互设计..........................................................................................21 3.1 OrCAD Capture 平台简介.................................................................................................21 3.2 OrCAD Capture 平台原理图设计流程............................................................................25 3.2.1 OrCAD Capture 设计环境......................................................................................25 3.2.2 创建新项目.............................................................................................................28 3.2.3 放置器件并连接.....................................................................................................29 3.2.4 器件命名和设计规则检查.....................................................................................30 3.2.5 跨页连接.................................................................................................................33 3.2.6 网表和Bom ............................................................................................................34 3.3 OrCAD Capture 平台原理图设计规范............................................................................35 3.3.1 器件、引脚、网络命名规范.................................................................................35 3.3.2 确定封装.................................................................................................................36 X Contents 3.3.3 关于改板时候的器件名问题.................................................................................36 3.3.4 原理图可读性与布局.............................................................................................37 3.4 正标与反标.........................................................................................................................38 3.5 设计交互..............................................................................................................................41 第4 章 PCB Editor 设计环境和设置..................................................................................44 4.1 Allegro SPB 工作界面.......................................................................................................44 4.1.1 工作界面与产品说明.............................................................................................44 4.1.2 选项面板.................................................................................................................47 4.2 Allegro SPB 参数设置.......................................................................................................49 4.3 Allegro SPB 环境设置.......................................................................................................53 第5 章 封装库的管理和设计方法........................................................................................63 5.1 PCB 封装库简介................................................................................................................63 5.2 PCB 封装命名规则............................................................................................................69 5.3 PCB 封装创建方法实例....................................................................................................70 5.3.1 创建焊盘库.............................................................................................................71 5.3.2 用Pad Designer 制作焊盘.....................................................................................72 5.3.3 手工创建PCB封装................................................................................................84 5.3.4 自动创建PCB封装................................................................................................89 5.3.5 封装实例以及高级技巧.........................................................................................93 5.4 PCB 封装库管理................................................................................................................98 第6 章 PCB设计前处理........................................................................................................100 6.1 PCB 设计前处理概述......................................................................................................100 6.2 网表调入............................................................................................................................100 6.2.1 封装库路径的指定...............................................................................................101 6.2.2 Allegro Design Authoring/Capture CIS 网表调入...............................................102 6.2.3 第三方网表...........................................................................................................104 6.3 建立板框............................................................................................................................106 6.3.1 手动绘制板框.......................................................................................................106 6.3.2 导入DXF 格式的板框.........................................................................................110 6.4 添加禁布区.......................................................................................................................112 6.5 MCAD-ECAD 协同设计................................................................................................115 6.5.1 第一次导入Baseline的机械结构图...................................................................115 XI 目 录 6.5.2 设计过程中的机械结构修改...............................................................................117 6.5.3 设计结束后建立新的基准（Re-Baseline）.......................................................122 第7 章 约束管理器...................................................................................................................123 7.1 约束管理器（Constraint Manager）介绍.....................................................................123 7.2 物理约束（Physical Constraint）与间距约束（Spacing Constraint）....................128 7.2.1 Physical 约束和Spacing 约束介绍......................................................................128 7.2.2 Net Group 和Net Class.........................................................................................128 7.2.3 建立Net Class.......................................................................................................129 7.2.4 为Class添加对象.................................................................................................130 7.2.5 设置Physical 约束的Default 规则......................................................................131 7.2.6 建立扩展Physical约束........................................................................................133 7.2.7 为Net Class添加Physical 约束..........................................................................134 7.2.8 设置Spacing约束的Default 规则......................................................................135 7.2.9 建立扩展Spacing 约束........................................................................................135 7.2.10 为Net Class添加Spacing约束.........................................................................136 7.2.11 建立Net Class-Class间距规则..........................................................................137 7.2.12 层间约束（Constraints By Layer）...................................................................137 7.2.13 Same Net Spacing 约束.......................................................................................138 7.2.14 区域约束.............................................................................................................138 7.2.15 Net 属性..............................................................................................................141 7.2.16 Component 属性和Pin 属性..............................................................................142 7.2.17 DRC 工作表........................................................................................................142 7.2.18 设计约束.............................................................................................................143 7.3 实例：设置物理约束和间距约束.................................................................................144 7.3.1 Physical 约束设置.................................................................................................145 7.3.2 Spacing 约束设置.................................................................................................147 7.4 电气约束（Electrical Constraint）................................................................................148 7.4.1 Electrical 约束介绍...............................................................................................148 7.4.2 Wiring 工作表.......................................................................................................149 7.4.3 Impedance 工作表.................................................................................................153 7.4.4 Min/Max Propagation Delays 工作表...................................................................154 7.4.5 Relative Propagation Delay 工作表......................................................................156 7.4.6 Total Etch Length 工作表.....................................................................................158 7.4.7 Differential Pair 工作表........................................................................................159 7.5 实例：建立差分线对......................................................................................................164 XII Contents 第8 章 PCB布局......................................................................................................................168 8.1 PCB 布局要求...................................................................................................................168 8.2 PCB 布局思路...................................................................................................................171 8.2.1 接口器件，结构定位...........................................................................................171 8.2.2 主要芯片布局.......................................................................................................172 8.2.3 电源模块布局.......................................................................................................174 8.2.4 细化布局...............................................................................................................174 8.2.5 布线通道、电源通道评估...................................................................................175 8.2.6 EMC、SI、散热设计...........................................................................................178 8.3 布局常用指令...................................................................................................................180 8.3.1 摆放元件...............................................................................................................180 8.3.2 按照Room 放置器件...........................................................................................183 8.3.3 按照Capture CIS 原理图页面放置器件.............................................................186 8.3.4 布局准备...............................................................................................................188 8.3.5 手动布局...............................................................................................................191 8.4 其他布局功能...................................................................................................................195 8.4.1 导出元件库...........................................................................................................195 8.4.2 更新元件（Update Symbols）.............................................................................196 8.4.3 过孔阵列（Via Arrays）.....................................................................................197 8.4.4 模块布局和布局复用...........................................................................................198 第9 章 层叠设计与阻抗控制...............................................................................................202 9.1 层叠设计的基本原则......................................................................................................202 9.1.1 PCB 层的构成.......................................................................................................202 9.1.2 合理的PCB层数选择..........................................................................................203 9.1.3 PCB 层叠设置的常见问题...................................................................................204 9.1.4 层叠设置的基本原则...........................................................................................205 9.2 层叠设计的经典案例......................................................................................................205 9.2.1 四层板的层叠方案...............................................................................................205 9.2.2 六层板的层叠方案...............................................................................................206 9.2.3 八层板的层叠方案...............................................................................................207 9.2.4 十层板的层叠方案...............................................................................................208 9.2.5 十二层板的层叠方案...........................................................................................208 9.2.6 十四层以上单板的层叠方案...............................................................................210 XIII 目 录 9.3 阻抗控制............................................................................................................................210 9.3.1 阻抗计算需要的参数...........................................................................................210 9.3.2 利用Allegro软件进行阻抗计算.........................................................................213 第10 章 电源地处理................................................................................................................217 10.1 电源地处理的基本原则................................................................................................217 10.1.1 载流能力.............................................................................................................218 10.1.2 电源通道和滤波.................................................................................................220 10.1.3 直流压降.............................................................................................................220 10.1.4 参考平面.............................................................................................................221 10.1.5 其他要求.............................................................................................................221 10.2 电源地平面分割.............................................................................................................222 10.3 电源地正片铜皮处理....................................................................................................226 10.4 电源地处理的其他注意事项........................................................................................231 10.4.1 前期Fanout .........................................................................................................231 10.4.2 散热问题.............................................................................................................233 10.4.3 接地方式.............................................................................................................235 10.4.4 开关电源反馈线设计.........................................................................................237 第11 章 PCB布线的基本原则与操作.............................................................................241 11.1 布线概述及原则.............................................................................................................241 11.1.1 布线中的DFM要求..........................................................................................241 11.1.2 布线中的电气特性要求.....................................................................................244 11.1.3 布线中的散热考虑.............................................................................................246 11.1.4 布线其他总结.....................................................................................................246 11.2 布线规划............................................................................................................................246 11.2.1 约束设置.............................................................................................................246 11.2.2 Fanout ..................................................................................................................247 11.2.3 布线.....................................................................................................................251 11.3 手动布线..........................................................................................................................253 11.3.1 添加走线.............................................................................................................253 11.3.2 布线编辑命令.....................................................................................................260 11.3.3 时序等长控制.....................................................................................................265 11.4 各类信号布线注意事项及布线技巧...........................................................................268 XIV Contents 第12 章 全局布线环境（GRE）.......................................................................................274 12.1 GRE 功能简介................................................................................................................274 12.1.1 新一代的PCB布局布线工具............................................................................275 12.1.2 自动布线的挑战.................................................................................................275 12.1.3 使用GRE 进行布局规划的优点.......................................................................276 12.2 GRE 高级布局布线规划...............................................................................................278 12.2.1 GRE 参数设置....................................................................................................279 12.2.2 处理Bundle.........................................................................................................281 12.2.3 规划Flow............................................................................................................284 12.2.4 规划验证.............................................................................................................287 12.3 高级布局布线规划流程................................................................................................290 12.4 高级布局布线规划实例................................................................................................292 12.5 自动互连技术Auto-I.XX..............................................................................................297 12.5.1 Flow 的快速创建及连接....................................................................................297 12.5.2 自动Breakout 的应用........................................................................................300 第13 章 PCB 测试...................................................................................................................306 13.1 测试方法介绍.................................................................................................................306 13.2 加测试点的要求.............................................................................................................308 13.3 加入测试点.....................................................................................................................308 13.4 测试点的生成步骤.........................................................................................................315 第14 章 后处理和光绘文件输出........................................................................................317 14.1 DFX概述........................................................................................................................317 14.1.1 可制造性要求（DFM）....................................................................................318 14.1.2 可装配性要求（DFA）.....................................................................................319 14.1.3 可测试性要求（DFT）......................................................................................319 14.2 丝印（Silkscreen）........................................................................................................319 14.2.1 丝印调整.............................................................................................................320 14.2.2 丝印设计常规要求.............................................................................................321 14.3 丝印重命名及反标注....................................................................................................322 14.3.1 器件编号重命名（Rename）............................................................................322 14.3.2 反标（Back Annotation）..................................................................................325 XV 目 录 14.4 工程标注.........................................................................................................................325 14.4.1 尺寸标注.............................................................................................................326 14.4.2 技术说明文档资料（Drill 层相关生产需求说明）.......................................332 14.5 输出光绘前的检查流程................................................................................................335 14.5.1 基于Check List 的检查......................................................................................335 14.5.2 Display Status 检查............................................................................................335 14.5.3 报表检查.............................................................................................................336 14.6 光绘输出.........................................................................................................................338 14.6.1 钻孔文件.............................................................................................................339 14.6.2 CAM 输出...........................................................................................................343 14.7 其他..................................................................................................................................349 14.7.1 valor 检查所需文件............................................................................................349 14.7.2 3D 视图...............................................................................................................349 14.7.3 打印PDF.............................................................................................................350 第15 章 PCB 设计的高级技巧...........................................................................................357 15.1 Skill 二次开发................................................................................................................357 15.2 团队协同设计.................................................................................................................361 15.3 设计数据导入导出.........................................................................................................366 15.4 无盘设计.........................................................................................................................371 15.5 背钻设计.........................................................................................................................373 15.6 DFA可装配性设计........................................................................................................378 15.7 走线跨分割检查（Segments over Voids）.................................................................381 15.8 Extracta ............................................................................................................................382 15.9 优化（Gloss）................................................................................................................384 15.10 Data Tips........................................................................................................................388 15.11 3D Viewer ......................................................................................................................389 15.12 任意角度走线...............................................................................................................391 15.13 超级蛇形线...................................................................................................................393 15.14 Ravel 语言.....................................................................................................................393 15.15 差分对的返回路径的过孔..........................................................................................395 15.16 Shape 编辑应用模式....................................................................................................396 15.17 Time Vision——High Speed Product Option ............................................................398 第16 章 高速PCB 设计.........................................................................................................400 16.1 高速PCB 设计理论.......................................................................................................400 XVI Contents 16.1.1 高速PCB 设计定义............................................................................................400 16.1.2 高速PCB 相关的一些基本理论........................................................................402 16.1.3 高速PCB 设计基本原则....................................................................................409 16.2 信号完整性仿真.............................................................................................................410 16.2.1 普通信号完整性问题.........................................................................................410 16.2.2 时序问题（Timing）.........................................................................................412 16.2.3 GHz 以上串行信号问题.....................................................................................414 16.3 电源完整性仿真设计....................................................................................................416 16.3.1 直流电源问题.....................................................................................................416 16.3.2 交流电源问题.....................................................................................................417 16.4 板级EMC 设计..............................................................................................................420 16.4.1 板级EMC 设计的关注点..................................................................................420 16.4.2 Cadence 的EMC设计规则................................................................................423 第17 章 DDR3的PCB 设计实例.....................................................................................425 17.1 DDR3介绍......................................................................................................................425 17.1.1 Fly-By 设计.........................................................................................................428 17.1.2 动态ODT............................................................................................................430 17.1.3 其他更新.............................................................................................................430 17.2 DDR3 PCB 设计规则....................................................................................................431 17.2.1 时序规则.............................................................................................................431 17.2.2 电源设计要求及层叠、阻抗方案.....................................................................433 17.2.3 物理、间距规则.................................................................................................434 17.2.4 电气规则.............................................................................................................446 17.3 DDR3布局......................................................................................................................454 17.3.1 放置关键器件.....................................................................................................454 17.3.2 模块布局.............................................................................................................456 17.4 布线..................................................................................................................................459 17.4.1 电源处理.............................................................................................................459 17.4.2 Fanout ..................................................................................................................462 17.4.3 DDR3布线..........................................................................................................463 17.5 信号完整性和电源完整性仿真设计...........................................................................467 17.5.1 信号完整性仿真.................................................................................................467 17.5.1.1 定义仿真模板...................................................................................... 467 17.5.1.2 加载零件IBIS模型.............................................................................. 468 17.5.1.3 编辑互连线模型.................................................................................. 471 XVII 目 录 17.5.1.4 仿真设置.............................................................................................. 474 17.5.2 仿真结果展示.....................................................................................................475 17.5.2.1 时钟信号(800MHz) ............................................................................475 17.5.2.2 控制信号(800Mbps) ...........................................................................477 17.5.2.3 地址、命令信号(800Mbps) ...............................................................478 17.5.3 电源完整性仿真................................................................................................. 480 17.5.3.1 PowerDC仿真结果展示.......................................................................480 17.5.3.2 PowerSI仿真结果展示.........................................................................482 第18 章 小型化设计................................................................................................................485 18.1 小型化设计的工艺流程................................................................................................485 18.1.1 HDI 技术.............................................................................................................485 18.1.2 埋入零件.............................................................................................................491 18.2 实例：盲、埋孔设计....................................................................................................491 18.3 盲、埋孔设计的其他设置............................................................................................495 18.4 埋入零件设计的基本参数设置...................................................................................498 18.4.1 实例：埋入零件.................................................................................................501 18.4.2 埋入零件生产数据输出.....................................................................................505 第19 章 射频设计.....................................................................................................................509 19.1 RF PCB 设计背景..........................................................................................................509 19.2 RF PCB 设计的特点......................................................................................................511 19.3 RF PCB 设计流程..........................................................................................................511 19.4 Analog/RF 设计常用的命令.........................................................................................520 附录 帮助文件使用说明.........................................................................................................541 参考资料...........................................................................................................................................553 1 1.2 PCB 设计流程简介..............................................................................................................4 1.3 高级PCB 设计工程师的必备知识....................................................................................5 1.4 基于Cadence 平台的PCB 设计........................................................................................5 第2 章 Allegro SPB 平台简介................................................................................................8 2.1 Cadence PCB 设计解决方案...............................................................................................8 2.1.1 PCB Editor技术........................................................................................................9 2.1.2 高速设计.................................................................................................................12 2.1.3 小型化.....................................................................................................................14 2.1.4 设计规划与布线.....................................................................................................14 2.1.5 生产制造选件.........................................................................................................15 2.1.6 模拟/射频设计........................................................................................................17 2.1.7 团队协作设计.........................................................................................................18 2.1.8 PCB Autorouter 技术..............................................................................................18 2.2 Allegro SPB 软件安装......................................................................................................18 第3 章 原理图和PCB交互设计..........................................................................................21 3.1 OrCAD Capture 平台简介.................................................................................................21 3.2 OrCAD Capture 平台原理图设计流程............................................................................25 3.2.1 OrCAD Capture 设计环境......................................................................................25 3.2.2 创建新项目.............................................................................................................28 3.2.3 放置器件并连接.....................................................................................................29 3.2.4 器件命名和设计规则检查.....................................................................................30 3.2.5 跨页连接.................................................................................................................33 3.2.6 网表和Bom ............................................................................................................34 3.3 OrCAD Capture 平台原理图设计规范............................................................................35 3.3.1 器件、引脚、网络命名规范.................................................................................35 3.3.2 确定封装.................................................................................................................36 X Contents 3.3.3 关于改板时候的器件名问题.................................................................................36 3.3.4 原理图可读性与布局.............................................................................................37 3.4 正标与反标.........................................................................................................................38 3.5 设计交互..............................................................................................................................41 第4 章 PCB Editor 设计环境和设置..................................................................................44 4.1 Allegro SPB 工作界面.......................................................................................................44 4.1.1 工作界面与产品说明.............................................................................................44 4.1.2 选项面板.................................................................................................................47 4.2 Allegro SPB 参数设置.......................................................................................................49 4.3 Allegro SPB 环境设置.......................................................................................................53 第5 章 封装库的管理和设计方法........................................................................................63 5.1 PCB 封装库简介................................................................................................................63 5.2 PCB 封装命名规则............................................................................................................69 5.3 PCB 封装创建方法实例....................................................................................................70 5.3.1 创建焊盘库.............................................................................................................71 5.3.2 用Pad Designer 制作焊盘.....................................................................................72 5.3.3 手工创建PCB封装................................................................................................84 5.3.4 自动创建PCB封装................................................................................................89 5.3.5 封装实例以及高级技巧.........................................................................................93 5.4 PCB 封装库管理................................................................................................................98 第6 章 PCB设计前处理........................................................................................................100 6.1 PCB 设计前处理概述......................................................................................................100 6.2 网表调入............................................................................................................................100 6.2.1 封装库路径的指定...............................................................................................101 6.2.2 Allegro Design Authoring/Capture CIS 网表调入...............................................102 6.2.3 第三方网表...........................................................................................................104 6.3 建立板框............................................................................................................................106 6.3.1 手动绘制板框.......................................................................................................106 6.3.2 导入DXF 格式的板框.........................................................................................110 6.4 添加禁布区.......................................................................................................................112 6.5 MCAD-ECAD 协同设计................................................................................................115 6.5.1 第一次导入Baseline的机械结构图...................................................................115 XI 目 录 6.5.2 设计过程中的机械结构修改...............................................................................117 6.5.3 设计结束后建立新的基准（Re-Baseline）.......................................................122 第7 章 约束管理器...................................................................................................................123 7.1 约束管理器（Constraint Manager）介绍.....................................................................123 7.2 物理约束（Physical Constraint）与间距约束（Spacing Constraint）....................128 7.2.1 Physical 约束和Spacing 约束介绍......................................................................128 7.2.2 Net Group 和Net Class.........................................................................................128 7.2.3 建立Net Class.......................................................................................................129 7.2.4 为Class添加对象.................................................................................................130 7.2.5 设置Physical 约束的Default 规则......................................................................131 7.2.6 建立扩展Physical约束........................................................................................133 7.2.7 为Net Class添加Physical 约束..........................................................................134 7.2.8 设置Spacing约束的Default 规则......................................................................135 7.2.9 建立扩展Spacing 约束........................................................................................135 7.2.10 为Net Class添加Spacing约束.........................................................................136 7.2.11 建立Net Class-Class间距规则..........................................................................137 7.2.12 层间约束（Constraints By Layer）...................................................................137 7.2.13 Same Net Spacing 约束.......................................................................................138 7.2.14 区域约束.............................................................................................................138 7.2.15 Net 属性..............................................................................................................141 7.2.16 Component 属性和Pin 属性..............................................................................142 7.2.17 DRC 工作表........................................................................................................142 7.2.18 设计约束.............................................................................................................143 7.3 实例：设置物理约束和间距约束.................................................................................144 7.3.1 Physical 约束设置.................................................................................................145 7.3.2 Spacing 约束设置.................................................................................................147 7.4 电气约束（Electrical Constraint）................................................................................148 7.4.1 Electrical 约束介绍...............................................................................................148 7.4.2 Wiring 工作表.......................................................................................................149 7.4.3 Impedance 工作表.................................................................................................153 7.4.4 Min/Max Propagation Delays 工作表...................................................................154 7.4.5 Relative Propagation Delay 工作表......................................................................156 7.4.6 Total Etch Length 工作表.....................................................................................158 7.4.7 Differential Pair 工作表........................................................................................159 7.5 实例：建立差分线对......................................................................................................164 XII Contents 第8 章 PCB布局......................................................................................................................168 8.1 PCB 布局要求...................................................................................................................168 8.2 PCB 布局思路...................................................................................................................171 8.2.1 接口器件，结构定位...........................................................................................171 8.2.2 主要芯片布局.......................................................................................................172 8.2.3 电源模块布局.......................................................................................................174 8.2.4 细化布局...............................................................................................................174 8.2.5 布线通道、电源通道评估...................................................................................175 8.2.6 EMC、SI、散热设计...........................................................................................178 8.3 布局常用指令...................................................................................................................180 8.3.1 摆放元件...............................................................................................................180 8.3.2 按照Room 放置器件...........................................................................................183 8.3.3 按照Capture CIS 原理图页面放置器件.............................................................186 8.3.4 布局准备...............................................................................................................188 8.3.5 手动布局...............................................................................................................191 8.4 其他布局功能...................................................................................................................195 8.4.1 导出元件库...........................................................................................................195 8.4.2 更新元件（Update Symbols）.............................................................................196 8.4.3 过孔阵列（Via Arrays）.....................................................................................197 8.4.4 模块布局和布局复用...........................................................................................198 第9 章 层叠设计与阻抗控制...............................................................................................202 9.1 层叠设计的基本原则......................................................................................................202 9.1.1 PCB 层的构成.......................................................................................................202 9.1.2 合理的PCB层数选择..........................................................................................203 9.1.3 PCB 层叠设置的常见问题...................................................................................204 9.1.4 层叠设置的基本原则...........................................................................................205 9.2 层叠设计的经典案例......................................................................................................205 9.2.1 四层板的层叠方案...............................................................................................205 9.2.2 六层板的层叠方案...............................................................................................206 9.2.3 八层板的层叠方案...............................................................................................207 9.2.4 十层板的层叠方案...............................................................................................208 9.2.5 十二层板的层叠方案...........................................................................................208 9.2.6 十四层以上单板的层叠方案...............................................................................210 XIII 目 录 9.3 阻抗控制............................................................................................................................210 9.3.1 阻抗计算需要的参数...........................................................................................210 9.3.2 利用Allegro软件进行阻抗计算.........................................................................213 第10 章 电源地处理................................................................................................................217 10.1 电源地处理的基本原则................................................................................................217 10.1.1 载流能力.............................................................................................................218 10.1.2 电源通道和滤波.................................................................................................220 10.1.3 直流压降.............................................................................................................220 10.1.4 参考平面.............................................................................................................221 10.1.5 其他要求.............................................................................................................221 10.2 电源地平面分割.............................................................................................................222 10.3 电源地正片铜皮处理....................................................................................................226 10.4 电源地处理的其他注意事项........................................................................................231 10.4.1 前期Fanout .........................................................................................................231 10.4.2 散热问题.............................................................................................................233 10.4.3 接地方式.............................................................................................................235 10.4.4 开关电源反馈线设计.........................................................................................237 第11 章 PCB布线的基本原则与操作.............................................................................241 11.1 布线概述及原则.............................................................................................................241 11.1.1 布线中的DFM要求..........................................................................................241 11.1.2 布线中的电气特性要求.....................................................................................244 11.1.3 布线中的散热考虑.............................................................................................246 11.1.4 布线其他总结.....................................................................................................246 11.2 布线规划............................................................................................................................246 11.2.1 约束设置.............................................................................................................246 11.2.2 Fanout ..................................................................................................................247 11.2.3 布线.....................................................................................................................251 11.3 手动布线..........................................................................................................................253 11.3.1 添加走线.............................................................................................................253 11.3.2 布线编辑命令.....................................................................................................260 11.3.3 时序等长控制.....................................................................................................265 11.4 各类信号布线注意事项及布线技巧...........................................................................268 XIV Contents 第12 章 全局布线环境（GRE）.......................................................................................274 12.1 GRE 功能简介................................................................................................................274 12.1.1 新一代的PCB布局布线工具............................................................................275 12.1.2 自动布线的挑战.................................................................................................275 12.1.3 使用GRE 进行布局规划的优点.......................................................................276 12.2 GRE 高级布局布线规划...............................................................................................278 12.2.1 GRE 参数设置....................................................................................................279 12.2.2 处理Bundle.........................................................................................................281 12.2.3 规划Flow............................................................................................................284 12.2.4 规划验证.............................................................................................................287 12.3 高级布局布线规划流程................................................................................................290 12.4 高级布局布线规划实例................................................................................................292 12.5 自动互连技术Auto-I.XX..............................................................................................297 12.5.1 Flow 的快速创建及连接....................................................................................297 12.5.2 自动Breakout 的应用........................................................................................300 第13 章 PCB 测试...................................................................................................................306 13.1 测试方法介绍.................................................................................................................306 13.2 加测试点的要求.............................................................................................................308 13.3 加入测试点.....................................................................................................................308 13.4 测试点的生成步骤.........................................................................................................315 第14 章 后处理和光绘文件输出........................................................................................317 14.1 DFX概述........................................................................................................................317 14.1.1 可制造性要求（DFM）....................................................................................318 14.1.2 可装配性要求（DFA）.....................................................................................319 14.1.3 可测试性要求（DFT）......................................................................................319 14.2 丝印（Silkscreen）........................................................................................................319 14.2.1 丝印调整.............................................................................................................320 14.2.2 丝印设计常规要求.............................................................................................321 14.3 丝印重命名及反标注....................................................................................................322 14.3.1 器件编号重命名（Rename）............................................................................322 14.3.2 反标（Back Annotation）..................................................................................325 XV 目 录 14.4 工程标注.........................................................................................................................325 14.4.1 尺寸标注.............................................................................................................326 14.4.2 技术说明文档资料（Drill 层相关生产需求说明）.......................................332 14.5 输出光绘前的检查流程................................................................................................335 14.5.1 基于Check List 的检查......................................................................................335 14.5.2 Display Status 检查............................................................................................335 14.5.3 报表检查.............................................................................................................336 14.6 光绘输出.........................................................................................................................338 14.6.1 钻孔文件.............................................................................................................339 14.6.2 CAM 输出...........................................................................................................343 14.7 其他..................................................................................................................................349 14.7.1 valor 检查所需文件............................................................................................349 14.7.2 3D 视图...............................................................................................................349 14.7.3 打印PDF.............................................................................................................350 第15 章 PCB 设计的高级技巧...........................................................................................357 15.1 Skill 二次开发................................................................................................................357 15.2 团队协同设计.................................................................................................................361 15.3 设计数据导入导出.........................................................................................................366 15.4 无盘设计.........................................................................................................................371 15.5 背钻设计.........................................................................................................................373 15.6 DFA可装配性设计........................................................................................................378 15.7 走线跨分割检查（Segments over Voids）.................................................................381 15.8 Extracta ............................................................................................................................382 15.9 优化（Gloss）................................................................................................................384 15.10 Data Tips........................................................................................................................388 15.11 3D Viewer ......................................................................................................................389 15.12 任意角度走线...............................................................................................................391 15.13 超级蛇形线...................................................................................................................393 15.14 Ravel 语言.....................................................................................................................393 15.15 差分对的返回路径的过孔..........................................................................................395 15.16 Shape 编辑应用模式....................................................................................................396 15.17 Time Vision——High Speed Product Option ............................................................398 第16 章 高速PCB 设计.........................................................................................................400 16.1 高速PCB 设计理论.......................................................................................................400 XVI Contents 16.1.1 高速PCB 设计定义............................................................................................400 16.1.2 高速PCB 相关的一些基本理论........................................................................402 16.1.3 高速PCB 设计基本原则....................................................................................409 16.2 信号完整性仿真.............................................................................................................410 16.2.1 普通信号完整性问题.........................................................................................410 16.2.2 时序问题（Timing）.........................................................................................412 16.2.3 GHz 以上串行信号问题.....................................................................................414 16.3 电源完整性仿真设计....................................................................................................416 16.3.1 直流电源问题.....................................................................................................416 16.3.2 交流电源问题.....................................................................................................417 16.4 板级EMC 设计..............................................................................................................420 16.4.1 板级EMC 设计的关注点..................................................................................420 16.4.2 Cadence 的EMC设计规则................................................................................423 第17 章 DDR3的PCB 设计实例.....................................................................................425 17.1 DDR3介绍......................................................................................................................425 17.1.1 Fly-By 设计.........................................................................................................428 17.1.2 动态ODT............................................................................................................430 17.1.3 其他更新.............................................................................................................430 17.2 DDR3 PCB 设计规则....................................................................................................431 17.2.1 时序规则.............................................................................................................431 17.2.2 电源设计要求及层叠、阻抗方案.....................................................................433 17.2.3 物理、间距规则.................................................................................................434 17.2.4 电气规则.............................................................................................................446 17.3 DDR3布局......................................................................................................................454 17.3.1 放置关键器件.....................................................................................................454 17.3.2 模块布局.............................................................................................................456 17.4 布线..................................................................................................................................459 17.4.1 电源处理.............................................................................................................459 17.4.2 Fanout ..................................................................................................................462 17.4.3 DDR3布线..........................................................................................................463 17.5 信号完整性和电源完整性仿真设计...........................................................................467 17.5.1 信号完整性仿真.................................................................................................467 17.5.1.1 定义仿真模板...................................................................................... 467 17.5.1.2 加载零件IBIS模型.............................................................................. 468 17.5.1.3 编辑互连线模型.................................................................................. 471 XVII 目 录 17.5.1.4 仿真设置.............................................................................................. 474 17.5.2 仿真结果展示.....................................................................................................475 17.5.2.1 时钟信号(800MHz) ............................................................................475 17.5.2.2 控制信号(800Mbps) ...........................................................................477 17.5.2.3 地址、命令信号(800Mbps) ...............................................................478 17.5.3 电源完整性仿真................................................................................................. 480 17.5.3.1 PowerDC仿真结果展示.......................................................................480 17.5.3.2 PowerSI仿真结果展示.........................................................................482 第18 章 小型化设计................................................................................................................485 18.1 小型化设计的工艺流程................................................................................................485 18.1.1 HDI 技术.............................................................................................................485 18.1.2 埋入零件.............................................................................................................491 18.2 实例：盲、埋孔设计....................................................................................................491 18.3 盲、埋孔设计的其他设置............................................................................................495 18.4 埋入零件设计的基本参数设置...................................................................................498 18.4.1 实例：埋入零件.................................................................................................501 18.4.2 埋入零件生产数据输出.....................................................................................505 第19 章 射频设计.....................................................................................................................509 19.1 RF PCB 设计背景..........................................................................................................509 19.2 RF PCB 设计的特点......................................................................................................511 19.3 RF PCB 设计流程..........................................................................................................511 19.4 Analog/RF 设计常用的命令.........................................................................................520 附录 帮助文件使用说明.........................................................................................................541 参考资料...........................................................................................................................................553